FSI Equipment Upgrade Program
FSI International’s support services provide product and
process enhancements to extend the life of installed FSI equipment,
enabling customers to realize a higher return on their capital
investment.
We offer a range of upgrade packages to improve reliability
and productivity, and to enable FSI equipment to run new and
different
processes. Upgrade packages are currently available for the
MERCURY®
Spray Cleaning System, ZETA® Spray
Cleaning System, ANTARES®/ARIES®
CyroKinetic Advanced Cleaning System and POLARIS® Microlithography Clusters.
FSI service and sales representatives can advise you about the
product and process upgrades available for your specific requirements.
Please contact them for more information on the following upgrades.
MERCURY® Spray
Cleaning System
Since the MERCURY® was introduced
in 1990, there have been many improvements and additional options.
FSI offers upgrade packages for the following enhancements:
- Increased throughput
- Lower chemical consumption
- Reduced cost on PR strip and post-ash clean
- Upgrading system CPU
- Increased wafer size
- Improved performance through process changes/modifications
ZETA® Spray
Cleaning System
FSI offers upgrade packages for the following enhancements:
- Increased throughput
- Lower chemical consumption
- Reduced cost on PR strip and post-ash clean
- Improved performance through process changes/modifications
In 2003, FSI introduced the FlashClean™ Advantage package
to further enhance the ZETA®
System’s productivity and performance.
The FlashClean™ Advantage for the ZETA®
System offers:
- Cycle time reduction and throughput improvement
- Improved particle performance with excellent
results down to 60nm
This package consists of hardware, software and process advancements.
Field upgrades are available for the installed base of ZETA®
Systems.
ANTARES®/ARIES®
CryoKinetic Advanced Cleaning Systems
The first CryoKinetic cleaning system offered by FSI was the
ARIES® System. In 2000, the
Aries was replaced by the ANTARES®
system to offer improved throughput and to extend the capability
to 300mm wafers. FSI offers upgrade packages for both systems
for the following enhancements:
- Increased particle removal efficiency at small
particle sizes
- Effective particle cleaning on mechanically
sensitive structures without damage
- Reduced cost of ownership
In 2003, FSI introduced the AspectClean™ package, a new
CryoKinetic process for removing defects on sensitive device structures.
This new process provides customers a method of removing defects
from back-end-of-line (BEOL) patterned low-k structures that will
not alter the k value or physically damage the structures.
The AspectClean™ package consists of hardware, software
and process advancements. Field upgrades are available for the
installed base of ANTARES® Systems.
POLARIS® Systems & Services
Since the introduction of the POLARIS® Resist Processing Systems in the early 1990s, many improvements and additional options are now available for these systems. FSI offers upgrade packages for the following enhancements:
- Increased throughput
- Reduction in defects
- CD uniformity improvement
- Cost of Ownership improvement
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